Chinese semiconductor companies adopt glass substrate packaging to bypass TSMC patents
Chinese chipmakers are pivoting to glass substrate packaging as a deliberate route around TSMC's dominant patent position in advanced packaging. A new partnership between JD.com and Corning marks a concrete signal of accelerating domestic momentum behind this strategy.
4 MIN READ · 20 JUN
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In this story
Today's signals
China's three policy banks complete RMB 800 billion instrument deployment
3 MIN · 1 NOVPinglu Canal surpasses 1 million tonnes in first month of operation
3 MIN · 1 NOVListed banks' corporate loan growth slows sharply in Q3 2026
3 MIN · 1 NOVEU adds €2 handling fee on small parcels from November 2026
2 MIN · 1 NOVNDRC coordinates record-breaking national grid response to 2026 summer peak demand
3 MIN · 1 NOVGreat Wall Motors to begin Bulgaria vehicle production in Q1 2027
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